3DXSTAT ESD PC - Black / 1.75mm / 750g - 3DXTech

Package Contains: 1 x 3DXSTAT ESD PC - Black / 1.75mm / 750g - 3DXTech

3DXSTAT? ESD PC is an advanced ESD-Safe compound designed for use in critical applications that require protection against electrostatic discharge (ESD). Manufactured using state-of-the-art multi-walled carbon nanotube technology, cutting-edge compounding technology and precision extrusion processes. Target surface resistance of 10^7 to 10^9 Ohms.
Polycarbonate (PC) advantages include:
High thermal properties including a Tg of 147°C
Amorphous structure gives low, nearly isotropic shrinkage
Excellent ductility and impact resistance
Very low odor emission during printing
Wide processing range of 265-300°C
3DXSTAT? advantages include:
Constant surface resistivity
Improved impact retention and elongation
Low particulate contamination
Minimal contribution to outgassing and ionic contamination
Typical PC ESD applications include:
Semi-con: HDD components, wafer management, masks, enclosures and connectors
Industrial: transport, measurement and sensing applications
Target conductivity for 3DXSTAT ESD PC:
Surface resistivity of 10^7 to 10^9 ohms on 3DP sample using concentric ring test method.
Note: Internal studies have indicated that increasing extruder temperatures can achieve higher levels of conductivity. Similarly, lower extruder temperatures have resulted in lower levels of conductivity. Every printer is configured differently, not to mention different part geometry. Therefore, expect some trial and error time to understand how ESD PC filament works in your specific printer and application.
Surface conductivity as a function of extruder temperature:
The surface resistance of the printed ESD PC part varies with the temperature of the printer extruder. For example, if the test indicates that the part is too insulating, increasing the extruder temperature will result in better conductivity. Therefore, surface resistance can be "made up" by adjusting the extruder temperature up or down depending on the reading you receive from your side.
Filament specifications:
Diameter: 1.75 mm (+/- 0.05 mm)
Recommended print settings:
Extruder: 260-300°C
Platen temperature: 110-120°C
Platen preparation: adhesive or poly tape is recommended
Heated chamber: recommended, a chamber helps reduce warpage and improves layer adhesion
Supports: the universal support material AquaTek? X1 water-soluble USM is ideal for complex parts
Drying instructions: 120°C for 4 hours.