Silicone paste that can withstand high temperatures (200 ° C), applicable to all heat sinks due to its thermal properties and strong adhesion that allows bonding of the device to cool to its heatsink without the need for mechanical fixing. Ideal for all electronic devices, processors, CPUs, GPUs, RAMs, high power LEDs and Peltier cells. The operating temperature range extends to 200 ° C (with a max for short periods up to 300 ° C), the adhesive curing time is only a few minutes (repositionable up to 10 min). High thermal conductivity allows excellent heat transfer from the computer processor or any electronic device to its heat sink to keep the temperature low and prevent overheating.
The item that you can get for certain features differ from the one shown in the photo, depending on the production lot. However, the functionality is retained. The description of this item has been provided by automatic translation. If you have any questions, please do not hesitate to contact us.